Friday, 13 July 2012

On the first day we had been briefing about our internship's scope in HIIS company. The meeting was conducted by Engineer Siva Kumar Subramaniam. He storied about HIIS history background and our task. Based on him, we must use this chance to master soldering electronic board technique by standard soldering acceptability requirements and identify and sort each of the basic components of PIC board. We also mentioned about HIIS's product. It is water level controller. It records the water level value of a tank everyday. So, any case can be detects early if water's volume in the water tank changing as unusual. We have to experience from the first step this device is build up until the installation progress including the programming for IC that used.

We start with soldering the water leveling controller electronic circuit. This circuit consists of thru-hole connection and surface mount device. The components for this task are:
  1. relay
  2. capacitor
  3. resistor
  4. transistor
  5. voltage regulator
  6. diode
  7. LED
  8. switch
  9. push button
Nature of the soldering process may dictate that an acceptable connections may have the same characteristics for all three classes.Unacceptable connection may be rejected for all three classes.The connection criteria apply regardless of which methods of solderig used:
  1. soldering irons
  2. resistance soldering apparatus
  3. Induction wave / drag soldering
  4. reflow soldering
  5. intrusive soldering
Soldering